According to TSMC’s official announcement, the world’s leading semiconductor foundry began mass production of 2nm chips (N2) in Q4 2025, staying on schedule with its technology roadmap. The first commercial device expected to use the new chip is Apple’s iPhone 18.

Apple’s next-generation flagship, the iPhone 18 Pro Max, expected in 2026, will feature the new A20 Pro chip built on TSMC’s cutting-edge 2nm process, signaling a major leap in mobile computing power and efficiency.

Nanosheet transistor architecture redefines performance

What makes the 2nm process so revolutionary is TSMC’s adoption of nanosheet transistor architecture, also known as Gate-All-Around (GAA). This marks a major shift from the long-dominant FinFET technology.

GAA allows current to be controlled from all four sides of the channel using vertically stacked nanosheets. This significantly reduces current leakage, improves electrical control, and enhances power efficiency.

In short, future processors will not only be faster, but also cooler and more battery-efficient - an upgrade iPhone users have eagerly awaited.

Leading in transistor density and power efficiency

TSMC’s 2nm process is projected to lead the industry in transistor density and power performance.

Compared to the current 3nm N3E process, 2nm chips are 10–15% faster at the same power level or 25–30% more power-efficient at the same performance.

Transistor density is also significantly improved:

About 15% higher for mixed chip designs (logic + analog + SRAM)
Up to 20% higher for pure logic chips
Apple’s chip evolution underscores this leap. The A13 Bionic (7nm) used in the iPhone 11 had about 90–95 million transistors per mm². By the time the iPhone 15 Pro launched with the 3nm A17 Pro, that number had surged to 220–290 million.

With the A20 Pro (2nm), transistor density may reach 310–330 million/mm², nearly tripling performance since the iPhone 11.

What comes after 2nm? The A16 Angstrom era

Looking ahead, Apple and TSMC are already eyeing A16 (16 Angstrom) as the next major shift - not just in miniaturization but in power delivery.

TSMC plans to implement Super Power Rail (SPR) technology, moving power delivery lines to the backside of the wafer. This brings power directly to the transistor’s source and drain terminals, reducing voltage drop and enabling even denser chip layouts.

Expected to enter mass production in late 2026, this breakthrough could redefine chip stability, efficiency, and thermal performance.

Enhanced version N2P coming next

Alongside the standard 2nm process, TSMC is preparing to launch N2P, an enhanced version optimized for performance. It is expected to deliver an additional 5–10% speed boost at the same power level. Transistor density data for N2P remains unconfirmed, but its impact on high-end devices could be substantial.

iPhones of the future: Smarter, cooler, and longer-lasting

All of these advancements aim to make future iPhones faster, more responsive, better at AI processing, and more energy-efficient - a crucial feature for gaming and demanding apps.

If Apple stays on course, the upcoming iPhone 18 Pro Max and future models like the iPhone 20 won’t just be more powerful in the traditional sense. They’ll also be smarter, more sustainable, and thermally optimized, ensuring better user experience with less heat and longer battery life.

And with rivals racing to catch up, the 2nm milestone and beyond will no doubt ignite a new era of competition in global mobile innovation.

Hai Phong