More than 630GB of stolen data has revealed the first major details about Apple's upcoming iPhone 18 Pro and iPhone 18 Pro Max.
A cyberattack targeting Tata Electronics - one of Apple's key supply chain partners in India - resulted in the theft of hundreds of gigabytes of internal data, including documents directly related to the iPhone 18 Pro lineup.
Confidential motherboard diagrams exposed

The first major details about the iPhone 18 Pro and iPhone 18 Pro Max have emerged following a cyberattack on Tata Electronics, one of Apple's key manufacturing partners in India. Photo: FPT.
According to an exclusive confirmation by AppleInsider, the leaked files include motherboard design schematics for the iPhone 18 Pro and iPhone 18 Pro Max, technical documentation for the A20 Pro processor, and information about Apple's in-house C2 modem.
The breach became public on June 23 after Tata was identified as the target of a large-scale cyberattack in India.
Alongside Foxconn, Tata has become one of Apple's most important manufacturing partners, producing components and assembling premium iPhone models such as the iPhone 17 Pro.
According to the leaked information, the stolen files exceed 630GB in total size. Most of the data relates to Apple products currently under development or in production within the company's supply chain.
Following an initial review of the stolen archive, analysts confirmed that the attackers obtained logic board schematics for both the iPhone 18 Pro and iPhone 18 Pro Max.
These documents are considered highly sensitive because they detail the devices' internal hardware architecture.
The diagrams show the precise layout of multiple motherboard layers, the placement of individual components and processors, and identify several suppliers involved in manufacturing.
The documents also present the motherboard from multiple viewing angles, providing a detailed look at the device's internal architecture.
AppleInsider said the files display all the characteristics of official Apple engineering documentation. Many were created using Siemens NX, the engineering design software widely used by Apple during product development.
Beyond the motherboard schematics, the leaked archive also contains complete component identification lists for the iPhone 18 Pro and iPhone 18 Pro Max, revealing parts expected to appear in future commercial devices.
A20 Pro chip points to significant upgrades
One of the most closely watched documents concerns technical information for the A20 Pro processor, internally codenamed "Borneo."
Although the files do not disclose full technical specifications, they suggest Apple is preparing several significant improvements over the A19 Pro used in the iPhone 17 Pro lineup.
In addition to the expected performance gains, the documents reference a next-generation Image Signal Processor (ISP).
This could significantly improve photo quality, video recording capabilities and AI-powered image processing on the iPhone 18 Pro.
Another notable detail is the upgrade of display-related security features. Although the documents provide no further specifics, they suggest Apple continues investing heavily in hardware-level protection of user data.
Apple's C2 modem expected for iPhone 18 Pro
In addition to the A20 Pro processor, the leaked documents reference Apple's self-developed C2 modem, internally codenamed "Ganymede."
The files indicate that the C2 modem will be integrated into both the iPhone 18 Pro and iPhone 18 Pro Max. This aligns with rumors circulating since late 2025 and early 2026 suggesting Apple is accelerating efforts to reduce its reliance on Qualcomm modems.
If accurate, C2 would succeed the C1 modem and mark another major step in Apple's long-term strategy of controlling more of its own core hardware.
Developing its own modem allows Apple to optimize performance, improve power efficiency and integrate connectivity more tightly with its hardware ecosystem.
Only a brief reference to the iPhone Fold
Among the hundreds of gigabytes of stolen files, most documents relate to two devices identified by the internal codes V63 and V43, corresponding to the iPhone 18 Pro and iPhone 18 Pro Max.
Notably, almost no information appears regarding Apple products beyond the iPhone 18 generation.
The only exception is a brief reference to a foldable smartphone believed to be the long-rumored iPhone Fold, identified internally as V68.
However, the documents provide no further details regarding the foldable device's design, specifications or launch timeline.
Apple used fake product boxes to prevent leaks
Another interesting discovery from the leaked archive concerns Apple's methods of protecting product secrecy during development.
Two videos included in the data show Apple using deliberately misleading product packaging to prevent information leaks.
During development of the iPhone 17 Pro, the company reportedly created prototype packaging displaying an iPhone model that does not actually exist.
The image featured a camera module resembling that of the M4 iPad Pro rather than the final iPhone design. The approach appears intended to mislead employees, manufacturing partners and anyone with access to assembly lines.
Apple has long used fake logos and disguised hardware during product development, but such practices have rarely been revealed in video form before this incident.
Despite the scale of the breach, analysts believe much of the stolen information has limited value outside Tata's operations.
Many documents primarily concern quality control procedures, hardware testing, internal versions of iOS without user interfaces, assembly line operations and factory management.
Notably, Tata appears to have implemented stricter security measures than many other Apple suppliers.
Several documents listing components and product configurations had color information completely removed under non-disclosure agreement (NDA) requirements.
This level of protection has not always been consistently applied by Foxconn in previous years.
Another theory suggests the hacking group may have deliberately withheld its most sensitive documents to preserve negotiating leverage with Apple and Tata.
However, the public release of motherboard schematics for the iPhone 18 Pro and iPhone 18 Pro Max makes that explanation less convincing.
Compared with the cyberattack targeting Foxconn facilities in North America in May 2026, this breach provides considerably more useful information about Apple's future products.
Even so, analysts believe many of the iPhone 18 Pro Max's most important secrets have yet to be exposed.
Hai Phong