- Master's degree in material, mechanical, chemical, electrical engineering or equivalent if Fresher candidate.
- Bachelor's degree in material, mechanical, chemical, electrical engineering or equivalent and having at least 1-2 years as R&D Engineer for Semiconductor package product or assembly process for System in Package (SiP)
- English skill: At least Intermediate level
- No barrier to working abroad for a short time in South Korea or the other company World Wide sites
- Intermediate or higher level of utilization ability for AutoCAD